Wafer Process Engineer

Company: II-VI Inc.
Location: Fremont
Posted on: May 3, 2021

Job Description:

Wafer Process Engineer + Jobs + Login + Fremont, CA, USA + Full Time Email Me Similar Jobs Email Me This Job Responsibilities: Process owner for wafer singulation processes including dicing, sawing and cleaving. Responsible for sustaining for existing products as well as developing new processes for new products. Duties and responsibilities: Develop and sustain wafer singulation processes for multiple products and for multiple technology platforms. Communicate and collaborate across multiple teams including process engineering, product engineering, manufacturing, design, and failure analysis groups. Analyze statistical process control (SPC) data and respond appropriately to ensure processes are in control. Investigates and finds root cause for singulation related issues found on wafers. Qualifications: + The candidate must have minimum 5-year working experience with bachelor's degree or 2-year with advanced degree. Degree in engineering is a must. + Advanced experience and knowledge in device fabrication (such as sawing, lapping, grinding, polishing, or cleaving and singulation) is desirable, but not necessary. + The candidate must possess strong data analysis skills in process development and improvement, capable of solving complex process problems with minimum supervision and guidance. + Hand-on experienced and advanced knowledge in process standardization and statistical process control for high volume production. + Demonstrated project management skills + Good communication skill

Keywords: II-VI Inc., Fremont , Wafer Process Engineer, Other , Fremont, California